PCB Layout guideline-REV 07-090107.pdfVIP

Confidential – Engineering Department PCB Layout Guideline Revision History Revision Author Date Comment Rev.0 Wang wen hui 2004-09-15 Rev.0.1 Wang wen hui 2005-05-12 Rev.0.2 Wang Wen Hui 2007-08-15 Rev.0.3 Wang Wen Hui 2007-08-20 更新 SunCorp Logo Rev.0.4 Wang Wen Hui 2008-01-02 Add item 19 Rev.0.5 Wang Wen Hui 2008-06-18 Add item 20 , change Logo Rev.0.6 Wang Wen Hui 2008-12-23 Add guideline for test points;socket hole’s size Rev.0.7 CW Cheung 2008-01-7 Change format only Purpose of this Document This document is written for the engineers working in the engineering department of SGW. This document serves as the guideline for PCB layout design to achieve manufacturability based on SGW’s production in the areas of SMT, DICE bonding, Insertion and Assembly process. A. Check Lists 1. 所有PCB Layout 必須與SCH. 同步; 2. 間距(clearance) 檢查或同一網络檢查; 3. 連接特性(connectivity)檢查; 4. Gerber Files 檢查; a) 白油圖 b) 走線圖 c) 阻焊圖 d) 鑽孔圖 5. 檢查與生產密切相關的問題 a) 插件元件腳加白油圈.特別是電解電容和三極管; b) 絲印標識要清晰,不能產生歧義,避免SMD 打錯料; c) 元件孔的大小合適,特別是磁環線,充電線孔徑的大小； d) 元件封裝必須是公共庫裏的; e) 時鐘電阻靠近CPU ； f) 按鍵的大小,位置,功能核對檢查； g) Bonding IC 每個PIN 上都要加測試點(燒程式的4 個PIN 可以不加) ，直徑≥1.2mm 且要放在同一 面 6. Hi-Pot 檢查 a) 螺絲孔; b) 充電部分. 7. P/N 檢查 ___________________________________________________________________________________________ PCB Layout guideline-REV 07-090107 Page 1 of 9 Confidential – Engineering Department 8. 規則設定檢查 a) Mini track width: 0.15mm; b) Mini track clearance: 0.15mm; c) Mini via: drill size 0.3mm; pad size 0.5mm; d) PCB Copper pour clearance : 0.25mm or more