QFP带散热结构.docx

DHS QFP (Drop in Heat Spreader QFP) Offers a choice between a built in or exposed heat spreader, depending on cost and thermal characteristics The built in heat-spreader type supports a 2 to 2.5 watt chip (28mmSQ QFP) The exposed heat-spreader type is attached to the surface of the package and supports a 2.5 to 3 watt chip (28mmSQ QFP) The fusion of the heat spreader and the lead frame has resulted in lower thermal resistance The wire-bonded single-layered lead frame amalgamated with a separate heat spreader at the time of molding  HYPERLINK http://www.shinko.co.jp/english/product/leadframe/multilayer.html \l pagetop PAGETOP DPH QFP (Die Pad Heat Spreader QFP) A high-thermal-dissipation package with a heat spreader attached by adhesive tape to the lead frame Supports a 2.5 watt chip (28mm SQ QFP) The lead frame can be made of a strong copper alloy, while the heat spreader can be made of an alloy with good thermal conduction properties, making it possible to have different materials in the same package Electrical properties are improved by electrically connecting the heat spreader to the power source or the grounding lead By changing the wire bond conditions, the assembly process of the conventional single-layer lead frame can be used without alternations A high-thermal-dissipation package with a heat spreader attached by adhesive tape to the lead frame. (Type A) Heat spreader functions as the power source or ground plane by attaching a projection around the heat spreader and electrically connect to the power source or the ground lead. (Type B)  HYPERLINK http://www.shinko.co.jp/english/product/leadframe/multilayer.html \l pagetop PAGETOP E-DPH QFP (Exposed Die Pad Heat Spreader QFP) A high-heat-dissipating package where the heat spreader is attached to the single-layered lead frame by tape, and the heat spreader is designed so that it is exposed outside the package Supports a 2.5 to 3 watt chip. By attaching another heat-dissipating fin, a 3.0 to 3.5 watt chip