LIGA工艺及其在微机电系统中的应用.pptxVIP

LIGA Process and Its Application in MEMS;Basic Process and Materials Lithography Electroforming Molding Applications Actuator and Mechanisms Optics and Communication Microfluidics and Bio-MEMS;Lithography Irradiation Development Electroforming Electroplating CMP Molding Mold filling Mold Separation ;Deep X-ray lithography UV lithography Laser lithography Ion track lithography Nanoimprinting;Deep X-ray lithography Advantages: Extreme precision Depth of field Low intrinsic surface roughness Disadvantages Synchrotron facilities Masks with thick gold;;UV lithography Standard lithography equipment Lower resolution and aspect ratio Combined with DRIE or SU8 photo resist;Laser lithography The use of excimer laser ablation Maskless lithography 1 μm feature size Control over a wide range of ablation depths;Ion track lithography A method for the fabrication of nanowires Diameter of the pores in the range of 20 nm and several micrometers Aspect ratios exceeding 500. Randomly distributed. Gas sensors ;Nanoimprinting Low cost Requirement for resist Adhesion to substrate Multi layer nanoimprinting ;Electroforming VS. Electroplating Thicker Low adhesion Mechanical properties Material restrictions: Cu, Ni, Au……;Process parameters: Electrolyte additives DC AC Pulse Current density Bath temperature pH value ;Difficulty High aspect ratio trenches and recesses Sequential filling (Plating suppressor, anti-suppressor) ;Properties Electrical properties Mechanical properties: hardness, friction, wear Metal alloys: Ni-Co, Ni-W(hardness), Ni-P(wear) Co-deposited with Al2O3, diamond micro or nanoparticles Surface properties: roughness, wettability Surface modifying;One of the major advantages of the LIGA technique Hot embossing Thermal plastic polymer Above TG Below TG Slow process Shrinkage effect Injection molding Shorter cycle time Micro-powder injection molding Ceramic or metal powder High-temperature heating process ;Basic Process and Materials Lithography Electroforming Moldin