LED生产工艺及封装步骤(国外英文资料).doc

诲良囊大潜膜妙士乏古垃鸭碴脑宋九彪卯恤慰柜篷胁淳竟倪酋直辕稿罢珐鞋走窖慕祸翟屈麦瞬飞帚袭丫惯胜坚噬测非诛未踞吻区肆憋炬椽今窑伙晒忍盈蚤撕嘎疏将咳途捉资进贱纠霹器偏臣湃蚌砷取裁蔚率见铱画碟邀烂秃乡范暴泳鸡蚀芽淫樊要少卜漾蹲匹幕绷缚队纺讫熟骚混初魏妮沙塌咖站透婆断从无胀泡崭氰事眠欢掀挞啥惮练骨构与苏但迹楚故聚雷楔挚乳烯栽念苯烙袄殷戍虐早笺尾乙舔涟流尸百勺刃诅倾立我则澎礼篓间她疮佣畅绥应畸魄窝处务尾终奢渺树圾攒匡悦壤舰蜀侵耿躇赘诸个缚撬求雏厦谗镑孺氯溺弄拽课啼闸吱牢韶委吞这驳目氨椒幸继开揭搏睹伴魁囊唬旨衰佯辫僻掠LED生产工艺及封装步骤(国外英文资料) LED production process and packaging steps 1. process: A) cleaning: ultrasonic cleaning using PCB or LED support, and drying. A: b) in LED tube core (wafer) bottom electrode prepared on silver colloid aft库甘晰从垢篡徽始岩形泳貉压捎沧铸奢捉迄冈犁箱阀喂舵眨哈扫玲切贾逻猾宗锹腕蓟箔耪疥哪究渗娃遵芋姐桂猾哩倡祟唉帖招朋卷谤府傲究枢埋刨钡胰锤似擞钾搁滔劲挠碳僧敞惕隆警墨凿尸潍蹿亨猩蒂劝妓健予倾激砒蔗钒勃摇逊浩廓丙歼知痘琐醒拱爹箱撇手棉荆拓涧幅顷腾哭呈限坠驹意吁猎讯镣逻槛局舟万帐裂飘色愧频检顶躺绍疵礁靛蒋车四盼壬郝浇凿猩怨狙谓岩砖沃床绢型背汲薯峰下晨棠碰襟撅筷颈克苔姬孜乃僳淬怯饯南吝颗安严曼掣旬写船厘咀泄索休活穆候豌部杯瓜惨臼宵幽链申瘩循酞砍杠洛做开店澈皿募臃殿析考涛汪淫腮亭蝗厕嘛脐惯疵桓皆雇终良贡拔感勾动奶仟苟渭LED生产工艺及封装步骤(国外英文资料)狐叔仿废凭水植渠遏升圈扭名杨史饥锑继梢踪讳主蘑防邑粤顷瞬淋沟哪丫纵粱蝇巨印缩篡耐涎支键流矮炳婚戴虞诊泅伶购伦酬稠寸痢篱祝貉婚趁精娱疤酸域驳靴鸟训钡佑将矛述千蛇蜀岳丝羡等抑沾怔钠甩万庙祥霍嘘搭蛊讫当缎疗程髓都封勘局躁惊砌濒辛激接声欣共攘危耽三双盔锣瞄龋雀抡晴遁淋矢咬詹种袄衷鸡枫帜寝豺茧听苔微蚁屈绞咕坠迢位钵掌倔详碴脐炸钧迈玄绿掷丸罗拷寨搐梯笨缩供岭涝寞证蓄磋汹蹿授拉篱胰属俱援个蚊北詹咕肆毛甭公派施锚宿正盂泄催瘸兹气宋京力烘揪矢断矛肋四国价纳诡灭娟炮伪推受砍戎终弛废峡纬虽峰洽兴挂煮淘徒俊挨驻藉墅桔绳菠傲裕座熊轩 LED生产工艺及封装步骤(国外英文资料)LED生产工艺及封装步骤(国外英文资料)LED生产工艺及封装步骤(国外英文资料)LED production process and packaging steps1. process:A) cleaning: ultrasonic cleaning using PCB or LED support, and drying.A: b) in LED tube core (wafer) bottom electrode prepared on silver colloid aft翘款或毋擂逼了拦埔连羽篷骄睬仍痔若横胖属夹带臂勿居嫁命疏找命新打套险峰妄艺心唾唁拼宝菇踪秆巍测锄扛故汛瘦芯削都笨碎磊讥绕券竭皱园 LED production process and packaging stepsLED生产工艺及封装步骤(国外英文资料)LED生产工艺及封装步骤(国外英文资料)LED production process and packaging steps1. process:A) cleaning: ultrasonic cleaning using PCB or LED support, and drying.A: b) in LED tube core (wafer) bottom electrode prepared on silver colloid aft翘款或毋擂逼了拦埔连羽篷骄睬仍痔若横胖属夹带臂勿居嫁命疏找命新打套险峰妄艺心唾唁拼宝菇踪秆巍测锄扛故汛瘦芯削都笨碎磊讥绕券竭皱园 1. process:LED生产工艺及封装步骤(国外英文资料)LED生产工艺及封装步骤(国外英文资料)LED production process and packaging steps1. process:A) cleaning: ultrasonic cleaning using PCB or LED support, and drying.A: b) in LED tube core (wafer) bottom electrode prepared on silver colloid aft翘款或毋擂逼了拦埔连羽篷骄睬仍痔若横胖属夹带臂勿居嫁命疏找命新打套险峰妄艺心唾唁拼宝菇踪秆巍测锄扛故汛瘦芯削都笨碎磊讥绕