SMT基础知识(国外英文资料).doc

SMT基础知识(国外英文资料) SMT, a term of quality 1, the ideal solder joint The surface has good wettability, the molten solder in the metal to be welded on the surface of spreading, and form a complete, uniform and continuous solder layer, the contact angle should be less than 90 The correct amount of solder, solder enough but more or less The surface of good welding, solder joint surface should be complete, continuous and smooth, but not very bright appearance. The location of solder joint components welding end or pin on the pad position deviation in the specified range. 2, do not wet The solder and solder joint by welding metal formed on the surface of the contact angle is greater than 90 3, welding After the welding pad and PCB surface separation. 4, the bridge (drawbridging) The components of the end leave pad for the above bag oblique or standing 5, bridge The solder joint between two or more than two should not be connected to the solder wire welding is connected with the adjacent or branch of the solder joint. 6. After welding, the welding between the end pins and pads or sometimes electrically isolated phenomenon 7, sharp pull In a prominent outward solder solder burrs, but no contact with other conductors or solder joints 8, solder ball (solder ball) When welding adhesion in printed circuit board, Yin mask or a conductor on the solder ball. 9 holes The welding appears a hollow aperture 10, position offset (skewing) The solder joint in plane longitudinal or transverse and rotational direction deviates from a predetermined position. 11, visual inspection method (visual inspection) Use a magnifying glass to 2~5 times of lighting, observed with the naked eye PCBA solder joint quality inspection 12, the test after welding (inspection after aoldering) PCB complete quality inspection after welding. 13, repair (reworking) For the removal of surface mount repair process of local defects of the assembly. 14, patch test (placement inspection) Surface mount component mounting o