LED生产工艺(国外英文资料).doc

LED生产工艺(国外英文资料) A) cleaning: ultrasonic cleaning using PCB or LED support, and drying. A: b) in LED tube core (wafer) bottom electrode prepared on silver colloid after expansion, will expand after the tube core (wafer) placed in the thorn crystal on the stage, will die a pad installed in the PCB or LED support corresponding with thorn crystal pen under the microscope then, the sintered silver glue curing. C) pressure welding: aluminum wire or wire welding electrode will connect to the LED tube core, lead to current injection. LED installed directly on the PCB, commonly used aluminum wire welding. (white TOP-LED d) package: Gold welder) by dispensing with epoxy, LED tube core and welding line protection. Glue on the PCB board, there are strict requirements on solidified colloid shape, which is directly related to the brightness of backlight source products. This process will also bear the point of phosphor (white LED) task. E): if the backlight is welded by SMD-LED or other LED package, in the assembly process before, LED needs to be welded to the PCB board. F): all kinds of cutting film diffusion film, required by the back light reflection film punch die etc.. G) assembly: according to the drawings, various materials manual backlight source installed in the correct position. H) test: check the backlight optical parameters and light uniformity is good. 2. packing: according to the requirements of product packaging and warehousing. Two, packaging process 1. LED package will be the task of the outer leads connected to the electrode of LED chip, and protect the LED chip, and to improve the light extraction efficiency of the role. The key process for assembling, welding, packaging. 2. LED package LED package can be said to be all kinds of mainly used, corresponding to the dimensions according to different applications, radiation countermeasures and illumination effect. According to the classification of Lamp-LED, LED package TOP-LED, Side-LED, SMD-LED, High-Power-LED et