自动焊机中定位技术的研究.pdfVIP

摘要 配识别芯片，而后修正预存的焊点坐标为精确的焊点坐标。通过这样的方法对焊 点进行定位准确快捷。 本课题的成果大大改善我国中小企业当前芯片封装工艺的生产状况，具有非 常好的市场前景，将会产生巨大的经济效益与社会效益，产业化前景非常乐观。 此外，本研究对于我国开展半导体后工序制造设备的开发，具有重要参考价值。 关键词：机器视觉，焊点定位，中值滤波，直方图均衡，模板匹配，序贯相似检 测算法(SSDA)，类比学习 Abstract Abstract Ultrasonicaluminumwire bonderandultrasonicwirebonderare gold mainly to the withthe lead-frameinthelater of joint semiconductor applied chippad process aimsatthe automaticreconstructionof these producing．This achieving project manual inthe equipmentsusing smallandmedium-sized isfunded enterprises，which by ofEducationof Province． Department Guangdong The automatic after the equipmentreconstructing machinevision adopts automatic thesame of needs recognition tobe technology．Iftypechips jointed，the workersneedto and thenthe will once，and run just inspectidentify system needinterferemore．Theresttaskfurworkersisto the automatically,noany convey oneworkercan severalautomatic the bonders，and chips．So operate naturally