锡膏特性与测试(国外英文资料).docVIP

锡膏特性与测试(国外英文资料) Quality and testing of SMT soldering paste Author: anonymous | source: unknown | number: 27 | update time: 2006-10-30 19:04:49 Abstract: with the development of electronic packaging to high performance, high density and miniaturization, soldering paste and technology are extremely important. This paper discusses the quality of welding powder of SMT solder paste, the demand of flux carrier and the basic performance test of solder paste. Keywords: solder paste, welding powder, flux carrier The Quality and Testing of Solder Paste for SMT Abstract: Because of the development of high density, high performance and miniaturization in electronic packaging, solder paste material and technology become more and more important. This paper discussed the quality of SMT solder paste, including powder preparation, flux vehicle and basic testing. Keywords: solder paste, solder powder, flux vehicle 1 the introduction Solder paste is a paste composed of alloy welding powder and flux carrier. Cement components in the surface mount technology, promote the solder wetting, removal of oxide, sulfide, trace impurities and adsorption layer, protect the surface to prevent oxidation again, form a strong metallurgical bond, and so on. Solder paste printing is the first working procedure of SMT, which affects the following technologies such as patch, reflow welding, cleaning and testing, and directly determines the reliability of the product. According to the statistics, 72 percent of the defects and failures of electronic products are related to the welding paste, and the performance of the solder paste is critical to SMT. With fine pitch (FPT), ball grid array (BGA), no clean (NC), 0201, such as the rapid development of the technology, as well as relevant laws and regulations for certain harm to the health of the environment and materials, restrict or prohibit, butt paste composition and properties of demand is higher and higher. In the market, environmental protection and leg