电路板爬行腐蚀对云算及电子产品的挑战与威胁.pdfVIP

电子工艺技术 86 Electronics Process Technology 年 月 第 卷第 期 2013 3 34 2 电路板爬行腐蚀对云算及电子产品的挑战与威胁 陈星慈 （宜特科技股份有限公司，台湾 新竹 30072） 摘　要：电路板爬行腐蚀的现象是造成电子产品失效的常见因素。爬行腐蚀通常可发生在系统端、电路板以 及连接器和组件上，主要是因为电子产品暴露在含有高硫化物的相对潮湿的环境中。将主要针对非阻焊设计的电 路板，探讨三种不同表面处理（ImAg沉银、Post-Treatment ImAg抗氧沉银和HT OSP高温型有机保焊膜）经过四种 混和气体（H S、SO 、NO 和Cl ）腐蚀的加速试验后，所形成的爬行腐蚀现象。 2 2 2 2 关键词： 爬行腐蚀；云算；数据中心；表面处理 中国分类号： 文献标识码： 文章编号： TN60　 Ａ　 1001-3474（2013）02-0086-08 Challenges and Threat of Creep Corrosion to Cloud Computing and Electronic Products CHEN Cherie (Integrated Service Technology, Inc., Hsinchu 30072, Taiwan, China) Abstract: PCB Creep Corrosion is the common factor to cause electronic product failed. Creep corrosion usually occurs in terminal system, circuit board, connector and assembly, mainly because they are exposed to the humid environment containing high sulfide relatively. Circuit board creep corrosion phenomenon is caused by common factors of electronic products failure. Focus on the circuit board of non-solder mask design, discuss the corrosion phenomenon of three kinds of surface treatment ( ImAg, Post-Treatment ImAg, HT OSP ) after accelerated test of corrosion of four kinds of mixed gas (H S, SO , NO and Cl ). 2 2 2 2 Key Words: Creep corrosion; Cloud computing; Data center; Surface finish Document Code: A Article ID: 1001-3474,2013,02-0086-08 近几年云算渐趋盛行，人们日常生活之应用皆