晶圆搬运机器人的优化设计与联合仿真.pdfVIP

Classified Index: TP242.2 U.D.C: 621.914.32 Dissertation for the Master Degree of Engineering OPTIMAL DESIGN AND COLLABORATIVE SIMULATION OF WAFER HANDLING ROBOT Candidate: Baoen Zhao Supervisor: Zexiang Li Academic Degree Applied for: Master of Engineering Specialty: Mechatronics Engneering Affiliation: Shenzhen Graduate School Date of Defense: June, 2008 Degree-Conferring-Institution: Harbin Institute of Technology 摘 要 在很多技术领域特别是在半导体制造、汽车制造和消费电子制造领域高速高精 度的操作手的需求正在逐渐增加。在半导体领域已经有很多类 SCARA 晶圆搬运机 器人的应用。但是这些传统晶圆搬运机器人中很少能真正的达到高速高精度。 文中介绍了一种新型的四自由度（三个转动和一个平动）类 SCARA 机器人， 并详细介绍了它的设计、优化和仿真过程。这种机器人是由三个直接驱动旋转电机 和一个传统伺服电机驱动的，三个直接驱动电机组成了一个平面三转动关节的操作 手。传统伺服同滚珠丝杆用来实现垂直直线运动。这个平面三自由度系统是一个复 杂的动力学耦合系统。首先，建立了运动学模型、动力学模型和误差模型以作为设 计的基本信息和指导。为了获得高精度，设计了一种高刚度转动关节。为了获得高 速高精度，通过结构优化，得出了两个相对高刚性低惯量的机械臂。最后，在 ADAMS 中建立了包含柔性关节和柔性臂的虚拟样机。在 SimuLink 中搭建 PID 速 度反馈控制系统。然后用机械系统和控制系统的联合仿真的方法检测了平面三自由 度操作手的性能。通过联合仿真，证实了优化的臂具有较好的动力学性能。 关键字：误差模型；结构优化；柔性；联合仿真 ABSTRACT The need for high speed and high precision manipulator is increasing in many fields of technology, particularly in the fields of semiconductor manufacture，electronic consumer manufacture and automotive manufacture. Many SCARA-type wafer handling robot have been applied in semiconductor manufacture industry. However, a few of these conventional robots can actually fail to obtain high speed and high precision. A new kind of SCARA-type robot with 4DOF （three revolute and one transfer joints ） is introduced and its design, optimization and simulation process are detailed in this thesis. The robot is actuated by three