电线和软管建模及其对引线键合机动态性能影响分析.pdfVIP

Classified Index: TP751 U.D.C: 621 Dissertation for the Master Degree of Engineering DYNAMIC MODEL OF WIRES AND CABLES AND ITS INFLUNCE ON WIRE BONDER Candidate: Yinliang Xu Supervisor: Pro. Yu Wang Academic Degree Applied for: Master of Engineering Specialty: Control Science and Engineering Affiliation: Shenzhen Graduate School Date of Defence: December, 2009 Degree-Conferring-Institution: Harbin Institute of Technology 摘 要 在集成电路制造产业领域，随着芯片尺寸的缩小、I/O密度的增大、封装工艺及 材料的改进，对IC封装设备的动态响应速度和稳态定位精度提出更苛刻的要求。 为节约开发成本，缩短开发时间，提高效率，可以利用MSC系列软件可以建立虚 拟样机模型，为提高仿真效果，必须对一些影响键合机工作性能的外界干扰因素, 进行建模分析。其中，导线和软管为XY平台传输电源和控制信号，它们本身需随 着XY平台高速运动，在此过程中导线和软管反复弯曲变形及软管间摩擦，将会对 平台的高速运动和高精度定位产生不可忽略的影响。 本文首先对导线和软管进行数学建模分析，针对导线和软管在运动过程中发生非 线性大变形，拟定可行的模型辨识方案。然后利用BK测振仪，利用力锤触发运 动平台在X和Y方向上的低频振荡，进行实验测量弹性系数和阻尼系数。接下来, 结合键合机实际工作情况，对XY平台的运动轨迹进行规划，并设计合适的控制器 对导线和软管产生的干扰进行补偿和抑制，让平台能够达到期望的高速高精度要 求。最后基于SOLIDWORKS，ADAMS和MATLAB仿真软件，对所建模型进行联 合仿真分析，仿真结果表明，所建立的模型很好地模拟实际样机的工作情况。 关键词：键合机；导线和软管；轨迹规划；联合仿真 ABSTRACT In the domain of Integrated Circuit (IC) industry, with the ever decreasing size of chips, increasing density of I/O ports, improving packaging technique and material property, it poses more demanding requirement on the dynamic behavior and positioning accuracy of IC packaging devices. In order to reduce the cost, shorten the research time and improve the efficiency, MSC software could be utilized to build up a prototype, meanwhile some external factors that affect the performance of the wire bonding machine should be identified to make the simulation more accurate. Wire and