LED与LCD-TFT液晶的区别(国外英语资料).docVIP

LED与LCD-TFT液晶的区别(国外英语资料).doc

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LED与LCD-TFT液晶的区别(国外英语资料)

LED与LCD-TFT液晶的区别(国外英语资料) Leds are meant to be Light Emitting diodes, although they can also be used as a screen, but they are often used for large displays, such as large billboards outside the building. TFT LCD screen is a kind of material, Thin film Transistor, thin-film transistors, LCD without TFT material outside, still have the STN, UFB, etc., but the like mobile phone, notebook computer, PDA, digital cameras and other commonly used is TFT, some older mobile phone screen is likely to be used in the STN screen. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Summary of the LED LED (Light Emitting bond), a light-emitting Diode, is a solid-state semiconductor device that turns the electricity directly into Light. The heart of the LED is a semiconductor chip, chip attached on a bracket, at the end of the end is negative, the other end connected to the power of the anode, the whole chip is encapsulated by epoxy resin. Semiconductor chip consists of two parts, one part is a p-type semiconductor, dominated by holes in it, the other end is n-type semiconductor, here is mainly electronic. But when these two semiconductors are connected, they form a p-n junction between them. When a current flows through a wire to the chip, the electron will be pushed P area, electron and holes in the P zone compound, then will be issued in the form of photon energy, this is the principle of LED. The wavelength of light, the color of light, is determined by the material that forms the p-n junction. LED history Fifty years ago, it was understood that semiconductor materials produce basic knowledge of light. The first commercial diode was produced in 1960. Leds are English light emitting diode (LED), its basic structure is an electroluminescent semiconductor materials, placed in a wire rack, then sealed with epoxy resin around, namely solid encapsulatio

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