HTP-12B改进型研磨机.DOC

HIGHTOP 深圳市海拓光电技术有限公司 HTP-12B改进型研磨机 主要特点 可加工 中心加压式设计，并可根据加工要求任意设定研磨时间 加压、卸载及更换夹具研磨片方便快捷 加工质量稳定，返修率低 生产效率高（可数台并列组成生产线） Logo 及面板颜色可指定 可调速设计，并具有正反转功能，确保研磨品质 机壳防水设计，确保操作安全 分离及模块控制接线，维修容易 需要更全面的性能及机器参数请与我们联系 110mm (2) 机器净重： 28kg (3) 机器尺寸：450Lx220Wx500H (4) 研磨时间设定：99分99 秒 (Max.) (5) 研磨底盘转速: 0rpm ~ 180 rpm (6) 研磨底盘跳动（径向及周向）：10um(7) 配重压力: 2.1 ~ 3.6 kgf/cm(sq)(8) 电源: AC220V, 50 Hz SHENZHEN HIGHTOP PHOTOELECTRONIC TECHNOLOGY CO., LTD. HTP-12B Polisher Feature Designed for polish ceramic, quartz, glass, metal and plastic etc. Set pressure and time according to your needs. Storage, edit parameter of pressure and time. Very expediency to load, unload and exchange polish films. Polishing quality is stability and low repair coefficient. Manufacture efficiency is higher（collocation） Water can be used as polishing liquid, saving product cost. Machine Logo and plant color can be assigned. Designed to adjust velocity, to insure polishing quality. Atmosphere/water and power supply are designed in respectively, to insure operation is safety. Junction with respectively and module control to make repair easy. Please contact us if you need more detail. Parameter Polish pad OD: 110 mm Net weights: 28kg Dimensions: 450Lx220Wx500H Polish time setting: 99m59s (Max.) Polish pad velocity: 0rpm ~ 180 rpm Loading pressure: 2.1 ~ 3.6 kgf/cm(sq) Polish pad jumpiness: 10um Power supply: AC220V, 50 Hz