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沉铜背光不良问题的改善_肖云顺
Short Comment Introduction
Metallization Plating
2012 No.11
Improvement to the defect of the plating
the holes backlight
XIAO Yun-shun LUO Xiao-ming DENG Tao
Abstract This article introduced a problem about the PTH defect which had been traced and improved in
PTH process. We found the problems source through into exploration, and worked out effective improvement step.
Finally, we avoid PTH defect, stabilized PCB production in PTH process.
Key words Back Light; Load; Supervise; Standard; Sheet
PCBPTH
PTHPlated Through Hole
50X
10
108 20109
PCB 2011510
101
-28-
Metallization Plating
2012 No.11 Short Comment Introduction
201167A
241 30 12.45%
22 1 4.55%
7
219 29 13.24%
201223
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