手机pa及pcb板ansys热分析（Thermal analysis of mobile pa and PCB board ansys）.docVIP

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手机pa及pcb板ansys热分析（Thermal analysis of mobile pa and PCB board ansys）.doc

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手机pa及pcb板ansys热分析（Thermal analysis of mobile pa and PCB board ansys）

手机pa及pcb板ansys热分析（Thermal analysis of mobile pa and PCB board ansys） This article is contributed by walkingclud PDF documents may have a poor browsing experience at the WAP end. It is recommended that you choose TXT, or download the source file to the native view. Thermal design theory analysis and application of mobile PA and PCB board (PASSIONRFSOS) [key words] mobile PCB thermal design H. YF SO FT Figure 2.1 infrared light PA fever W. AR E CO 【 abstract 】 the mobile phone of PA is very important to the whole transmission circuit, for emission index, it not only impact on the emission performance and PA current consumption of mobile phone almost more than 60% of the total current, due to its low efficiency, the vast majority of energy is consumed in the form of heat, thereby PA also is the main source of mobile fever. PA application to improve the performance of both to launch, the machine current consumption to improve the talk time, or due to PA heat dissipation problems associated with the PCB and thermal design of the machine has a great influence. This article mainly described from the aspects of heat transfer, by some of the basic theory and method of thermal design of PCB and mobile phone of thermal design analysis and improvement Suggestions are put forward ., L TD FIG. 2. 2 P A heat curve under different power 1.1 theoretical basis of thermal design The thermal design of the main challenges are now smaller volume the popularity of portable products, closed structure without air flow, POWER consumption of the device package smaller, without the traditional Heat Sinks. So now the thermal design of the main is how to get rid of the traditional Heat Sinks, after how to efficient PCB design to solve only smaller packaging, smaller POWER PAD big POWER IC and the Heat dissipation problem. Factors influencing the temperature of the whole machine, Heat transfer is mainly divided into Heat conduction, Heat convection and thermal radiation. Heat conduction: is the d