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温度曲线的定制化分析和管理(Temperature curve customization analysis and management)
Temperature curve customization analysis and management
2008/11/25
Preface temperature curve (Profile) is most common in SMT welding process parameters, the relationship between the temperature time curve in a certain sense almost all represent the SMT welding technology, from the reflow, wave soldering, are used to repair it. Reflowprofiles are the most widely used and prevalent. The reflow soldering technology of SMT is a process of chemical and physical change of the devices temperature resistance, component thermal properties, solder characteristics. For this type of results (such as: solder joint reliability, strength, etc.) cannot directly determine the special process, process control by the appears is important, and temperature curve is process engineer, quality engineer to judge the complex process is correct, reliable and controlled the important basis. The importance of temperature curve in SMT welding process is shown. For a high quality of the assembly process, process engineer will be in the light of the characteristics of each product specification formulated the corresponding temperature curve, and through the daily quality control to ensure the welding quality of the final product. But as SMT products tend to be more diversified and complicated, more and more temperature curves also pose challenges to process management. Although the current temperature curve analysis software come with the corresponding temperature curve read, display, analysis, report output and even part of the function of the SPC, but limited in software curing, a few % 26 other Conventional throughout % 26; Data type cannot have satisfied more and differentiation, personalized products for the special requirements of the temperature curve, whats more, more and more users want the other key in the process of welding % 26 other Input throughout % 26; Information, such as component information, device informati
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