锡膏印刷质量控制（Solder paste printing quality control）.docVIP

锡膏印刷质量控制（Solder paste printing quality control） Solder paste printing quality control In reflow soldering of surface mount assemblies, solder paste is used to connect pins or terminals between surface mount components and pads. There are many variables, such as solder paste, screen printing machine, solder paste, application method and printing process. In the process of printing solder paste, the substrate is placed on the worktable, mechanically or vacuum clamped and positioned and aligned with a positioning pin or vision. Or screen (screen) or stencil (stencil) for solder paste printing. This paper will focus on several key solder paste printing problems, such as template design and printing process. Printing process and equipment In solder paste printing, the printer is the key to achieving desired print quality. Today, there are two main types of screen printing machines: laboratory and production. Each type is further classified because each company hopes to get different performance levels from the laboratory and the production type presses. For example, a companys research and development unit (RD) uses laboratory types to make product prototypes, while production uses another type. Also, production requirements may vary greatly depending on production. Because laser cutting equipment is impossible to classify, it is better to choose the silk screen machine which is compatible with the desired application. In manual or semi-automatic presses, the solder paste is placed manually on the stencil / screen, where the squeegee (squeegee) is at the other end of the template. In an automatic press, the solder paste is automatically allocated. In the printing process, the printing squeegee is pressed down on the template to cause the bottom of the template to contact the top surface of the circuit board. As the squeegee passes through the corroded entire graphics area length, the solder paste is printed onto the pad via an opening on the stencil / wire mesh. After th