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led封装普及知识(LED packaging universal knowledge)
LED packaging universal knowledge
This paper contributes to the construction of the project
Brief introduction of LED (LED) led (LED) products
order
Book
A light emitting diode (LED) light emitting diode (LED) of the main product structure of LED main process and material of two LED, the main process and material company three, the main products of the company mainly introduces the structure of LED LED, the four main parameters of photoelectric photoelectric parameters of the LED, LED has five advantages
A brief introduction of LED
LED (Light Emitting Diode), commonly known as a light emitting two stage body or light-emitting diode, contains visible and invisible light. Belongs to a class of photoelectric semiconductor in the structure, including the P and N poles, is to rely on a photoelectric element semiconductor pn junction, which is divided into Lamp series, Top series, piranha series, SMD series, High series Power (high power).... In Lamp, it is composed of electronic materials Lamp electronic materials (chip, gold or aluminum wire, electronic materials, stent, silver glue or insulation glue), packaging materials packaging materials (epoxy resin, coloring agent, packaging materials and auxiliary materials (mold) three materials. Diffusion agent) and auxiliary material auxiliary material definition: LED is a luminous closed circuit electronic component which is composed of electronic material, packaging material and auxiliary material.
LED five big material and five big process five big material and five big processes
Five big material chip bracket, silver glue line, epoxy resin welding line, sealing, cutting foot test, solid crystal five big process
LED major luminescent electronic materials - Wafers
The chip consists of gold pad, P pole, N pole, PN junction and back gold layer (double pad wafer without back gold layer). Wafer classification: 1.1 according to the composition: two yuan: such as GaAs (Shen Huajia), Ga
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