GUIDE TO NONDESTRUCTIVE TESTING ASM (无损检测指南ASM).pdf

GUIDE TO NONDESTRUCTIVE TESTING ASM (无损检测指南ASM).pdf

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GUIDE TO NONDESTRUCTIVE TESTING ASM (无损检测指南ASM)

NDT GUIDE TO NONDESTRUCTIVE TESTING This IBM z10 microproceesor chip is COMPARISON OF the type of product that must be inspected via nondestructive testing NDT METHODS methods. Image courtesy IBM. MAGNETIC PARTICLE INSPECTION SCANNING AUGER MICROPROBE GE Sensing Inspection Technologies Choose your color Get better views with the new Phasec 3 series of eddy current flaw detectors than you thought possible from such compact devices. Adjust the multiple color schemes on a Phasec 3 landscape screen to optimize your view and differentiate your data. Take a Phasec 3 anywhere. It’s light enough for single-hand operation, but ruggedly designed for use in difficult environments. The long-life battery will see you through hours of inspections. And when you get back to your computer, the Phasec 3’s integrated USB connection and easy-to-use software makes fast work of your data exchange. Visit /en to find more about the new Phasec 3 series. NDT Overview of Nondestructive Testing ondestructive Testing (NDT) and inspection techniques tive tests. Ultrasonic and X-ray methods account for about for detecting and evaluating flaws (irregularities or dis- another third, eddy current testing about 10%, and all other continuities) or leaks in engineering systems are re- methods for only about 2%. Table 1 is a simpli

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