Challenges in baredie mounting（挑战baredie安装）.pdf

Challenges in Bare Die Mounting Larry Gilg Die Products Consortium Austin, Texas Abstract Traditionally, the evolution of advanced IC assemblies has been due to defense and aerospace applications, where reliability, size and weight were at a premium, and cost was a secondary consideration. In the 1980’s, high performance computing became the advanced packaging development stimulus. That world changed again in the late 1990’s with the emergence of ubiquitous digital content, providing impetus to the consumer markets of digital cameras, cellular phones, portable computers, PDAs and other similar high volume applications; these have now become the “driver” for advanced assemblies of semiconductors. Assemblers of state of the art consumer products are developing sophisticated packaging and interconnect approaches that more and more rely on the use of die products for these types of applications. Die products are defined as bare die, bumped die or “wafer level packaged die” that change the overall “footprint” on the mounting substrate when the die size changes. This paper reviews several of the die products technologies, and outlines mounting challenges to their use. Introduction Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array p