波峰焊虚焊（Wave soldering.）.docVIP

波峰焊虚焊（Wave soldering.） Automatic welding technology wave, has been applied for many years in the electronics industry, but later on the solder joint failure is still a headache, it greatly affects the quality and credibility of electronic products. This paper intends to make a preliminary study on the practice and discussion. The so-called joint late failure, refers to the surface seems on the weld quality is acceptable, not the existence of a welding, no welding and tip, copper exposed welding defects in the workshop production, as there is nothing wrong with the machine, but to the user after a period of time, because poor welding, electrical conductivity difference caused by the fault has occurred, resulting in early repair rate is one of the reasons for high, this is the . Winbond technology department after repeated experiments that the main causes are as follows: The 1. printed board aperture and lead diameter mismatch The difference between hand plate aperture and lead diameter, should be in 0.2 - 0.3mm. The difference machine inserted in the aperture and the lead wire diameter, should be in 0.4 - 055mm. If the difference is too small, then the effect of plug-ins, such as the difference is too large, there is a chance to weld risk. In late 2. the damage rate of solder joints If the pad is too small, the amount of tin is too large, insufficient solder flat, will cause the small welding surface, conductive performance is poor, only properly, will get good welding quality, the reason is the process of solder joint formation, lead and pad and solder between the wetting flat the results of balance. And the need for a large current through the solder pads, be bigger after soldering, with tin wire welding, and even add rivet welding, solder joint to get reliable performance. The 3. component leads, PCB pad weldability is poor Component lead solderability, measured by the method of GB 2433.32-85 by wetting force test method weighing method can be welded, the zero cro