pcb抗干扰设计原则（The design principle of anti jamming PCB）.docVIP

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pcb抗干扰设计原则（The design principle of anti jamming PCB）.doc

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pcb抗干扰设计原则（The design principle of anti jamming PCB）

pcb抗干扰设计原则（The design principle of anti jamming PCB） Lets share some of the PCB anti interference design principles, and lets talk about or share some of the experience of drawing PCB boards. Thank you Layout of power line: 1, according to the current size, as far as possible to broaden the lead wiring. 2. The direction of power line and ground wire should be consistent with the direction of data transmission. 3, in printed circuit board power input end connected on the 10~100 - F decoupling capacitor. Two ground arrangement: 1 digital and analog separately. 2, grounding wire should be bold, less by 3 times the allowable current to the printed circuit board of the general target of 2~3mm. 3, the ground wire should be as far as possible the formation of dead loop circuit, this can reduce the earth wire potential difference. Three decoupling capacitor configuration: 1 、 the input capacitor of the printed circuit board is connected with an electrolytic capacitor of 10~100 F, which is better if it is larger than 100 mu F. 2. Each chip is bridged with an 0.01~0.1 F ceramic capacitor between the Vcc and the GND. If space is not allowed, a 1~10 F tantalum capacitor can be configured for each 4~10 chip. 3 、 anti noise capability is weak, turn off current changes in large devices, as well as ROM, RAM, Vcc and GND should be indirect decoupling capacitors. 4, in the microcontroller reset end RESET, with 0.01 F decoupling capacitor. 5, the decoupling capacitor leads can not be too long, especially the high frequency bypass capacitor can not lead. Four device configuration: 1, clock generator, crystal oscillator and CPU clock input should be close to and away from other low frequency devices. 2 、 small current circuit and high current circuit as far as possible from the logic circuit. 3. The position and direction of the printed board in the case shall ensure that the device with high heating capacity is located above. Five the power line, AC line and signal line are separated T