手机芯片的焊接技术（Welding technology of mobile phone chip）.docVIP

手机芯片的焊接技术（Welding technology of mobile phone chip） This paper from the Orient invincible 2010 contribution C The practice application of Vocational Education GVANGJSIHGYAUYUZ Welding technology of mobile phone chip Occupation Education Center School in Hechi city. The European Zhibai [Abstract] this paper introduces a small outline package (mobile phone chip SOP as shown in Figure 1) the lead pinout distribution in the core is usually 28 feet below the foot, then inverse tablets on both sides, with little or small pit is first feet, hour number. In the early days of the mobile phone products, using SOP package more, such as electronic switch, frequency synthesizer (SYN) power amplifier (PA) power controller (PAC, (FLASH, (EEP) Edition) code ROM chip adopt this kind of package.) Modern mobile phone products, less use of SOP chip. Quad flat package (QFP as shown in Figure 2, the lead in 20 feet above), the average distribution in IC square, with a first foot or with a small hole, and then counterclockwise number. High frequency circuit and a pin in the IC mobile phone more steps, such as early, intermediate frequency module power supply IC products also use such package. In the modern mobile phone products, the QFP package is not much. Ball grid array package (BGA as shown in Figure 3) is a multilayer chip carrier package, the pin with solder ball, in the bottom of the chip, according to the array arrangement, the bottom of the chip is directly connected with the PCB board. In the same package size, compared with the SOP package, QFP package, BGA package can accommodate the number of pins more, and can make the pin spacing between not too close. Modern handThe electrostatic damage to mobile phone components; a small brush, blowing balloons, to remove dust and impurities around the chip; solder paste, soldering and desoldering up welding, can also be used as flux rosin; anhydrous alcohol or water that day, to clean the board, the use of water that day the ful