无铅回焊（lead-free solder）.docVIP

无铅回焊（lead-free solder） Lead-free reflow soldering.Txt I. Preface The so-called Reflow, in surface mount industry (SMT), refers to the solder alloy ingot shape or bar shape, after melting and forming for tin (micro solder ball is round spherical), and organic materials (flux) collocation and deployment become solder paste; the printing, foot, patch, and return to the melting and curing process become metal solder joints, called Reflow Soldering (reflow). The word of the Chinese translated a lot, such as reflow soldering, reflow soldering, reflow welding (Japanese translation), reflow; I feel like this is the loose paste again and condense and become molten, healing of solder joints, so the author has earlier translation called fusion. But in order to have no difference with the popular terms, and consider the meaning of literal, circuitous or itinerant, but have the connotation of welding again when it comes back to molten state, it should be called reflow or reflow. Figure 1. the sirtec company is located in the Guanyin industrial area, the installation of SMT solder paste printing machine, in order to avoid the surface of the water and dry paste steel plate trouble reasons, the machine remained firmly sealed cover state. See the steel plate, scraper and lead-free solder paste after the cover is opened. Two, solder paste manufacturing and quality 2.1 solder paste composition and voids Figure 2. tin reflow release a lot of factors influence the tin and solder joint strength, here are five directions, based on years of experience in the field, and solder paste printing and reflow curve (Profile) of three for welding quality of the proportion is as high as seven or eight more, this paper will focus on the following three the contents of introduction, the machine operation will no longer be part of the ink. The paste is tiny ball by weight ratio of solder alloy made of 88-90% (called Powder, 10-12% and tin) organic materials (also known as the Flux flux) consisting of t