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激光切割穿孔(Laser cutting perforation)
激光切割穿孔(Laser cutting perforation)
Cutting and punching technique
Any hot cutting technique, except for a small number of cases, can be carried out at the edge of the plate, and a small hole must be generally worn on the plate. Prior to the laser stamping machine, the punch was punched out of a hole, and then the laser began to cut from the hole. There are two basic methods for punching a laser cutter without a press:
Explosive perforation - the material forms a dimple at the center after the continuous laser radiation, and then the molten material is removed rapidly by the oxygen current coaxial with the laser beam to form a hole. The size and thickness of the plate hole, the average diameter of half the thickness of the blasting perforation, so the plate blasting thick aperture is larger, and not round, should not be used in the processing of high precision parts, can only be used for waste. In addition, as the oxygen pressure used in the perforation is the same as the cutting, the splash is larger.
Pulse perforation: with high peak power pulse laser to make a small amount of material melting or vaporization, commonly used in air or nitrogen gas as auxiliary, to decrease due to the exothermic oxidation so that the hole expansion, gas pressure is cutting oxygen pressure. Each pulsed laser produces only small particles and gradually goes deeper, so it takes a few seconds for the plate to pierce. Once the perforation has been completed, the auxiliary gas is immediately converted to oxygen for cutting. Thus, the perforation diameter is smaller, and the perforation quality is better than that of blasting perforation. Therefore, the laser used should not only have higher output power, but also more importantly, the temporal and spatial characteristics of the beam. Therefore, the general transverse flow CO2 laser can not meet the requirements of laser cutting. In addition, a more reliable gas path control system must be adopted for the pulse punching to realize the switch
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