微电子芯片封装第二讲（Second lectures on microelectronic chip packaging）.docVIP

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微电子芯片封装第二讲（Second lectures on microelectronic chip packaging）.doc

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微电子芯片封装第二讲（Second lectures on microelectronic chip packaging）

微电子芯片封装第二讲（Second lectures on microelectronic chip packaging） This article is contributed by Shuai 516507805 Ppt documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view. Packaging technology of integrated circuit chip Guilin University of Electronic Technology, Career Technical College Curriculum introduction and main contents 1 、 integrated circuit chip packaging and microelectronic packaging Microelectronics packaging technology = integrated circuit chip packaging technology microelectronics packaging technology integrated circuit chip packaging technology 2, chip packaging technology involves the field and function 3, packaging technology levels and classification Encapsulation technology concept Microelectronic packaging: A, Bridge, from, IC, to, System, microelectronics packaging: IC Board The concept of microelectronic packaging Narrow sense: chip level IC Packaging: chip level + system level: generalized: chip level + system level: Package Engineering Electronic packaging: substrate, chip package and discrete devices such as electronic packaging elements: substrate, chip package and discrete devices and other elements, are connected and assembled by electronic equipment requirements, to achieve a certain electrical connection, and according to the requirements of electronic assembly, to achieve a certain electrical and physical properties change the device or equipment with machine or system forms. A machine, device, or device that is in the form of a complete machine or system. Microelectronics packaging process = electronic machine manufacturing process, microelectronics packaging process, electronic machine production process Wafer Single IC Package SMA/PCBA Electronic Equipment Chip packaging involves the technical field, chip packaging technology involves physics, chemistry, chemical, materials, chip packaging technology, involving physics, chemistry, chemicals, ma