193nm 光刻技术介绍.pptVIP

193nm Lithography Adam T. Jones Department of Chemical Engineering Iowa State University Overview Semiconductor Lithography Current Materials and Processes 193nm Research Goals Semiconductor Fabrication Types of Resists Positive When the resist is irradiated with a certain wavelength of light, it becomes soluble in a solvent (called a developer) The area that is unexposed is insoluble Negative When the resist is irradiated with a certain wavelength of light, it becomes insoluble in the developer The area that is unexposed is originally soluble in the developer Wafer Processing Cont’d After exposure to light, the wafer is sprayed with a “developer” The developer is commonly an aqueous base such as tetramethylammonium hydroxide (TMAH) Following the development stage, the wafer is “postbaked” At this point the portions of the wafer that have no resist are filled with copper, gold, or some other conductive material The wafer is then coated with a layer of SiO2 and the process is repeated (up to 15 times) Current Materials Cresol and formaldehyde are reacted to create a novolak resin The polymer is maintained in a solvent (usually propylene glycol monomethyl ether acetate (PGMEA)) The photoactive compound (PAC) is usually a diazonaphthoquinone (DNQ) which is added after the polymerization A fluorine-based surfactant is also added which improves adhesion Current Materials cont’d DNQ-based resists currently are used with 365nm (i-line) light Majority of the current manufacture of semiconductors is carried out at this wavelength Deep-UV (248nm) resists can produce critical dimensions up to ~0.15?m Why does wavelength matter? Certain materials show good transparency at certain wavelengths (365, 248, 193, 157nm) Wavelength determines the sizes of the features on a silicon wafer Feature size reduction is the most important parameter Why does wavelength matter? 193nm Research Hybrid copolymers of cyclo-olefin/maleic anhydride (COMA) and methacrylate have been investigated1 C