晶片的来料检验 23页.pptVIP

* PC issue inspection requisition Box Label Device type Lot no Customer name Quantity Visual Sample Packing condition Wafer Qty Any damage 400x – 100x Dimension Thickness Ink thickness Complete Inspection Reports Incoming Wafer Inspection – PQI004 Chipouts on edge of die shall not penetrate into any active circuit area. Note: Active circuit area is defined as from outside edge of the bond pads inward, except where there is an active line in the design located beyond the outside edge of the bond pads Cracks 裂縫 碎片 邊緣 不可 穿透 線路 活性的 採納 報廢 Cracks shall not be longer than 1.0 mil inside active circuit area that points toward operating metal or functional circuit element. 裂縫 不可 超過限度 機能 線路 組成 Cracks that do not point toward operating metal or functional circuit elements shall not exceed 5.0 mils in length. (Silicon GaAs Die) 裂縫 指向 不 線路 活性的 不可 超過限度 Discoloration in glassivation outer layer is harmless and shall be acceptable, providing it is not obscuring any other damage. There shall be no corrosion in metallization, or any other layers. Metallization having any localized discoloration shall be closely examined and shall be rejected, unless it is demonstrated to be a harmless film, glassivation interface, or other non-obscuring effects.? Discoloration or Corrosion 變色 腐蝕狀態 玻璃鈍化 There shall be no Conductive (opaque) Foreign Material on the top of unglassivated die that is large enough to bridge two or more adjacent? metallization areas, and that cannot be removed Contamination or Foreign material 混淆 外來 料子 不透明 橋梁 Contamination or Foreign material There shall be no conductive (opaque) Foreign Material under the top glassivation layer of the die that is large enough to bridge two or more adjacent metallization areas There shall be no attached or embedded material in die that bridges two active circuit elements. GaAs: There shall be no attached or embedded material in die that reduces spacing of two active circuit elements by greater than