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- 2017-08-31 发布于上海
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焊膏印刷工艺技术的研究 research of solder-paste printing process
焊膏印刷工艺技术的研究
鲜飞
(烽火通信科技股份有限公司，湖北武汉430074)
摘要 焊膏印刷是sMT生产中关键工序之一，其控制直接影响着组装板的质量。本文介绍了焊膏印刷中影响质量
AoI
的诸多因素并分析其原因，并提出部分纠正措施和建议。同时文中扼要的介绍焊膏高度检测的原理及应用，指出了3D
是保证电子组装质量的必要手段。最后，本文还介绍了一些焊膏印刷的新技术。
关键词 焊膏；网板；印刷；表面贴装技术；缺陷；检测
中图分类号：TG44文献标识码：A 文章编号：1009一0096(2007)08一0055一09
ResearchofSolder—PasteProcess
Printing
XianFei
Abstract an inSMT
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