直流电场对Al-Cu共晶合金凝固组织的影响.PDF

36 / 2004 10 - Al Cu Effect of Direct Current Electric Field on the Microstructure of Al-Cu Eutectic Alloy , ( , 123000) HUAN Li-guo, ZHAN Wei-qiang (Department of Materials Science and Engineering, Liaoning T echnical University Fuxin, 123000, China) : - : , Al Cu : ; ; Al-Cu : T 146: A: 1001-4381 ( 2004) 10-0036-03 Abstract : T he effect of direct current electricfield on the solidified structure of Al-Cu eutectic alloy is studied. T he results show that the grain size and distance between layers of eutectic alloys are changed by the electricfield, thegrain size and distance between layers of the eutectic alloys experi- ences a process of refinement with the increaseof current density. An elementary analysis was given to discuss the mechanism of above results. Key words: DC electric field; solidified microstructure; Al-Cu eutectic alloy ( - (- ) , ) , . . [ 1] W Pfann 1 , (3. 1%3.4%C, 1.9% Al Cu , Cu 2. 8% Si ( , )) 33. 2% 2 45mA/ cm , 15mm70mm , , , , 15mm100mm , , [2] ƒ±Ê¶¿¼± , 700 , , 20min , , 20%40% , , 1 30% [3] , , , Misra 2 Pb-15%Sb-7%Sn , 084. 92mA/ mm [4] A.Prodhan : Al 2 , 5A ( ) 3A () , 2 , , (2a) , , , , (2b) , , ( , 2