切削在精度上超越抛光（Cutting; surpassing polishing in accuracy）.docVIP

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切削在精度上超越抛光（Cutting; surpassing polishing in accuracy）.doc

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切削在精度上超越抛光（Cutting; surpassing polishing in accuracy）

切削在精度上超越抛光（Cutting; surpassing polishing in accuracy） The cutting accuracy beyond polishing With cutting technology, great changes have taken place in precision machining (Figure 1). Even with nano micro shape and surface roughness of machining, than 0.1 M (100nm) is a small ultra precision machining has become possible, the mirror surface processing as shown in Figure 2 has become a reality in * 1. This is not a precision in machining after polishing was achieved. Compared with the polishing surface, but can get even more by cutting. The sense of being subversive. Figure 1: ultra precision machining The normal processing center (MC) the accuracy is about 10 m, which can be more precise than 100nm ultra precision machining has also unveiled MC. Figure 2: Machining on the surface of the reflection of the sample can be reflected By Sadegh (Sodick) was. (a) for the radius of the hemispherical surface cutting sample of 2mm, stainless steel material for one kind of STAVAX (HRC54), the processing time for each pit for 40 minutes. Processed in accordance with 1, 3, 4, 2 order. The machine is the use of AZ150, the surface roughness Ra is 7 ~ 8nm. (b) for example cutting plane, material and die steel SKD11 (HRC60), surface roughness Ra 6.0nm. *1 surface roughness is defined to include the arithmetic average and maximum height accuracy of Ra Ry. All of the interval line (base length L) was measured and the results were uneven (not including the big ups and downs) were calculated. The unit is mm, m etc. (length). Ra is the average height of the peak level of the absolute value of numerical integral after divided by L, Ry is the highest point (peak) and the lowest (Valley) height difference. Pv is the largest valley with big ups and downs, deep consideration. Precision machining is recognized as in electronic, optical, medical and other fields of energy and realize the product miniaturization, high function and energy saving of the common required technology. In the production