footprint（足迹）.docVIP

footprint（足迹） Part Encapsulation refers to the appearance and the position of the solder joint when the actual part is soldered to the circuit board. Is a purely spatial concept The component can be shared with the same part package, and the same component can also be packaged in different parts. As a traditional needle type resistor, this element A larger volume, the circuit board must be drilled to accommodate components, upon completion of the drilling, insert, and tin or tin spraying (or hand welding), The cost is higher, and newer designs are made of small surface mount components (SMD), which do not have to be drilled and are half finished with steel membranes The molten solder paste is poured into the circuit board, and then the SMD element is placed on the circuit board to be welded. Resistance AXIAL Non-polar capacitor RAD Electrolytic capacitor RB- Potentiometer VR Diode DIODE Triode TO Power supply block 78 and 79 series TO126H and TO-126V The FET is the same as the triode D44 D37 D46 rectifier bridge Single row multi pin socket, CON, SIP Dual in line element DIP Crystal oscillator XTAL1 resistor: RES1, RES2, RES3, RES4; package attributes for the axial series Non-polar capacitor: cap; the package property is RAD-0.1 to rad-0.4 Electrolytic capacitor: electroi; the package property is rb.2/.4 to rb.5/1.0 Potentiometer: Pot1, pot2; encapsulation property is VR-1 to vr-5 Diode: the package property is diode-0.4 (small power) diode-0.7 (high power) Triode: common packaging attributes for TO-18 (ordinary triode), to-22 (high-power transistor) TO-3 (high-power Darin) Catheter The power regulator blocks have 78 and 79 series; the 78 series, such as 780578127820, etc. The 79 series has 790579127920 Common encapsulation attributes are to126h and to126v Rectifier bridge: BRIDGE1, BRIDGE2: package attributes for the D series (D-44, D-37, D-46) Resistance: AXIAL0.3-AXIAL0.7, where 0.4-0.7 refers to the length of resistance, usually AXIAL0.4 Ceramic capacitors: RAD0.