电路板组装过程中可消除短路和开路故障的可测试性设计策略_百度文库...(The circuit board assembly to eliminate the short circuit and open circuit fault testability design strategy can process _ Baidu library...).doc

电路板组装过程中可消除短路和开路故障的可测试性设计策略_百度文库...(The circuit board assembly to eliminate the short circuit and open circuit fault testability design strategy can process _ Baidu library...).doc

  1. 1、本文档共12页,可阅读全部内容。
  2. 2、原创力文档(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
  3. 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载
  4. 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
电路板组装过程中可消除短路和开路故障的可测试性设计策略_百度文库...(The circuit board assembly to eliminate the short circuit and open circuit fault testability design strategy can process _ Baidu library...)

电路板组装过程中可消除短路和开路故障的可测试性设计策略_百度文库...(The circuit board assembly to eliminate the short circuit and open circuit fault testability design strategy can process _ Baidu library...) In this paper, a contribution by prodigy DOC documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view. A testable design strategy to eliminate short circuit and open circuit faults during circuit board assembly Huicong electronic components business network 2003-07-28 15:58:55 Electronic assembly testing consists of two basic types: bare board testing and load testing. Bare board test is carried out in complete circuit board production, mainly to check the open circuit and short circuit netlist, continuity. There are many other methods of inspection and verification in the process. The load test is done after the assembly process is completed, and it is more complex than the bare board test. Assembly phase testing includes: production defect analysis (MDA), online testing (ICT) and functional testing (enabling products to work in an application environment) and their combination of the three. In recent years, assembly testing has also increased the use of automatic optical inspection (AOI) and automatic X ray inspection. X ray image layered circuit board and different static image plane they can be provided on the circuit board, so as to determine the weld and solder bridging defects. The purpose of the research and testing strategy is to find the essential combination test scheme for a particular product. Before starting the design process, define the simple strategy for implementing the required tests. Consider product testability issues early in the product development cycle, not later. This greatly reduces the test cost of each node from the initial design to the final test, and achieves higher node testability. There are five types of common test, their main functions are as follows: bare board test

文档评论(0)

f8r9t5c + 关注
实名认证
内容提供者

该用户很懒,什么也没介绍

版权声明书
用户编号:8000054077000003

1亿VIP精品文档

相关文档