电镀二（Electroplating two）.doc

电镀二（Electroplating two） Huicong net [surface treatment] is not the same as gold or gold chemical method, chemical oxidation reduction reaction by generating a layer of coating, generally thicker, is a thick layer of gold can reach chemical nickel and gold layer deposition method; another is the replacement of gold, gold leaching, i.e. the replacement of gold, usually thinner, 1--4 micro inch gold plated only, can be plated thicker; gold and gold leaching for relatively high half board, flatness is better than gold, gold leaching of gold is better, generally does not appear the phenomenon of black pad after the assembly of gold deposit; because high purity, high joint strength is higher than that of the two. 1. what are the abbreviations and abbreviations for gold and gold plating? Answer: A.Electroless gold, no electrolytic gold leaching gold, Immersion gold (IG), gold Chemical, gold nickel, Electro-less, Nickel (EN),]B., electrolytic gold, Electrolytic, Gold, soft gold, Soft (Bondable), gold, hard gold, Hard, gold 2. how can nickel be used on copper (is it also chemically reduced)? Gold does not adhere to copper, so it needs nickel, right? Answer: when the temperature becomes high, the gold and copper pass through the nickel layer, causing migration to increase contact resistance, which is detrimental to the gold finger. Nickel has a barrier effect on the migration and Diffusion between gold and copper, so it is called Diffusion Layeror Barriermetal. It must be nickel plated before plating, with a thickness of at least U. 3., our supervisor said we would like to have a hard gold plating on the keypad (like the keypad of the phone). Can you fix some part of the hard metal? Is everything normal? Answer: Keypad provides contact with hard metal touch resistant. Is 4. hard gold or soft gold part of the process? They are using gold or gold or gold plating, dip soft gold, if only in the wire bond hard gold only in a golden finger thanks; soft gold in the process of electr