电镀复习题（Electroplating review questions）.doc

电镀复习题（Electroplating review questions） The first chapter is an overview 1. Electroplating: the process of depositing metal or alloy on the surface of substrate by electrochemical method. It is a method of surface modification, protection and some new properties. 2. Classification of electroplated coatings: according to application: protective coating, protective decorative coating, functional coating. According to the combination of the coating, it can be divided into simple coating and composite coating (layer and structure). According to the electrochemical relationship between basic metal and coating, it is divided into anode coating and cathode coating. 3, general electroplating process requirements for coating: compact structure, uniform thickness, strong bonding force The second chapter, electroplating basic theory 1. The relation between overpotential and grain critical size and nucleation speed: the bigger the overpotential is, the bigger the nucleation rate is, the finer the grain is 2. The effect of each component of electrolyte and its influence on the structure of sedimentary layer: 1 the influence of main salt concentration: under the condition of other conditions unchanged, the concentration of main salt increases, the speed of the nucleation of a decreases, and the grain is coarse. When the B salt concentration is high, some of the newly formed crystals begin to grow in part because of passivation. 2 free acid effects: strong acidic electrolyte (with free acid) a to improve the conductivity of solution, reducing cell voltage B to a certain extent improve the cathodic polarization, obtained fine plating C to prevent salt hydrolysis precipitation, thus affecting the quality of coating; weak acid plating solution (containing a small amount of free acid) to prevent hydrolysis of a add B buffer, maintain a stable pH value. 3 inorganic salts influence: increase conductivity, improve dispersion ability. The addition of foreign ions increases the ionic streng