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详解led封装全步骤(Detailed LED package full steps)
详解led封装全步骤(Detailed LED package full steps)
Detailed LED package full steps
Introduction: the following detailed description of the LED packaging of the entire production process, packaging technology and notes.
1. Production process
1. production:
A) cleaning: use ultrasonic cleaning PCB or LED holder, and drying.
A: b) in LED tube core (wafer) bottom electrode prepared on silver colloid after expansion, will expand after the tube core (wafer) placed in the thorn crystal on the stage, will die a pad installed in the PCB or LED support corresponding with thorn crystal pen under the microscope then, the sintered silver glue curing.
C) press welding: the electrode is connected to the LED core by aluminum wire or wire bonder to be used as the lead for the current injection. LED installed directly on the PCB, the general use of aluminum wire welding machine. (making white TOP-LED requires wire welding machine)
D) package: protect the LED core and solder line with epoxy through dispensing. On the PCB board dispensing, the shape of the gel after the strict requirements, which is directly related to the backlight products finished brightness. This process will also undertake the task of point phosphor (white light LED).
E) welding: if the backlight is made of SMD-LED or other packaged LED, the LED shall be soldered to the PCB board prior to the assembly process.
F) cutting film: use punch press cutting back light source for a variety of diffusion film, reflective film, etc..
(g) assembly: according to the drawing requirements, the various materials of the backlight are installed in the right place by hand.
(H) test: check the backlight, photoelectric parameters and the uniformity of light emission is good.
2. packing: packing and storage of finished products as required.
Two, packaging technology
1. LED encapsulation task
The external lead is connected to the electrode of the LED chip, and the LED chip is protected at the same time, and the efficiency of the light extracti
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