pcb知识（PCB knowledge）.docVIP

pcb知识（PCB knowledge） Chemical precipitation of copper In the manufacturing process of printed circuit boards, the key is to change the deep copper process. Non metal hole its main role is to make double-sided and multilayer printed circuit board, the reaction in the hole wall is deposited on the conductive layer by a uniform layer of redox, after electroplate copper reached the loop. To achieve this goal we must choose a stable chemical property, reliable heavy copper liquid and to make correct and the feasibility and effectiveness of the process. I. main points of technological process: 1. pretreatment of heavy copper; 2. activation treatment; 3. chemical precipitation of copper. Two. Treatment before heavy copper treatment: 1. to burr: copper substrate before drilling process, although this process is easy to produce burr, it is caused by inferior hole metallization of the most important hidden dangers. Deburring process must be adopted to solve the problem. Usually by mechanical means, make the hole edge and the inner wall of the hole without barbs or hole blocking phenomenon. 2. degreasing: The source of the oil drill due to hand contact pollution, fingerprints and other substrate. The type of oil, animal and vegetable oils, minerals etc.. The former belongs to saponification oils; the latter belongs to non saponification oils. The characteristics of oil: animal and vegetable oils are the main ingredients of saponification oil fatty acid and alkali, it plays a role in the reaction of water-soluble salts of fatty acids and glycerol; the chemical structure of mineral oil is mainly paraffin hydrocarbons, olefinic hydrocarbon and cycloparaffinic hydrocarbon mixture and chloride, insoluble in water and not alkali reaction. In addition to the selection method of disposal of oil: oil according to nature, according to the degree of oil contamination. The methods using organic solvents and chemical and electrochemical alkaline degreasing. The function and principle: - sa