热容型大功率半导体激光器瞬态热特性-发光学报.PDF

第37卷摇 第4期 发摇 光摇 学摇 报 Vol郾37 No郾4 2016年4月 CHINESEJOURNAL OF LUMINESCENCE Apr. ,2016 文章编号:1000鄄7032(2016)04鄄0422鄄06 热容型大功率半导体激光器瞬态热特性 * 贾冠男,尧摇 舜 ,高祥宇,兰摇 天,邱运涛,王智勇 (北京工业大学 激光工程研究院,北京摇 100124) 摘要:为研究热容型大功率半导体激光器在低环境温度、高瞬时功率、长工作间歇时间条件下的应用,建立 三维瞬态热传导模型,通过有限元法计算得出热沉三维尺寸对半导体激光器瞬态热特性的影响。 选取尺寸 为26.6 mm伊11.5 mm伊4 mm 的热沉进行热容型半导体激光器的封装测试,获得其在-20 益和-30 益环境 温度下连续工作3.5 s过程中有源区温度随时间的变化曲线,并与数值计算的结果进行对比。 结果表明,两 者在误差范围内能够很好地吻合。 关摇 键摇 词:激光器;半导体激光器;热容型;瞬态热特性 中图分类号:TN248.4摇 摇 摇 文献标识码:A摇 摇 摇 DOI:10.3788/ fgx0422 Transient Thermal Characteristics of Heat Capacity HighPower Diode Lasers * JIA Guan鄄nan,YAO Shun ,GAO Xiang鄄yu,LAN Tian,QIU Yun鄄tao,WANGZhi鄄yong (Institute of Laser Engineering,Beijing University of Technology,Beijing 100124,China) *Corresponding Author,E鄄mail:yaoshun@bjut.edu.cn Abstract:Toinvestigatetheapplicationof heatcapacityhighpowerdiodelasersunderthecondition of low temperature,high transient power and long interval working time,a 3鄄D transient thermal model was established. By adopting the finite element analysis,the effect of 3鄄D sizes of the heat sink on the transient thermal characteristicsof diode laserwascalculated successfully. According to the simulation results,the heat sink with dimension of26.6 mm伊11.5 mm伊4 mm was chosen to package theheatcapacity diodelaser,andtheexperimentsofthediodelaserworking3.5 scontinu鄄 ously under -20 益 and -30 益 were carried out respectively. Eventually,thetemperature curves of the active region were obtained and demonstrated a good consistence with the simulation results. Key words:laser;diode laser;heat capacity;transient thermal characteristic