2012最新应用于便携及消费产品的安森美半导体完整esd及emi保护方案（2012 A Morimi semiconductor complete ESD and EMI protection solutions for portable and consumer products）.docVIP

2012最新应用于便携及消费产品的安森美半导体完整esd及emi保护方案（2012 A Morimi semiconductor complete ESD and EMI protection solutions for portable and consumer products） For electronic products, the protection circuit is to prevent the critical sensitive devices in the circuit from being damaged by excessive flow, over-voltage and overheating. The advantages and disadvantages of protective circuits are crucial to the quality and lifetime of electronic products. With the continued growth of consumer demand for electronic products, more requirements have strong electrostatic discharge (ESD) protection, while reducing unnecessary electromagnetic interference (EMI) / radio frequency interference (RFI) noise. In addition, consumers expect the latest consumer electronics to meet the increasing download and bandwidth capabilities of smaller devices. As devices become smaller and more integrated with performance, the ESD and EMI/RFI suppression in many cases are no longer covered by the new generation of IC that drives the required interfaces. In addition, advanced system on chip (SoC) designs are fabricated using very small geometries. In order to optimize functionality and chip size, IC designers have been reducing the minimum size of their design features. The reduction of IC size makes the device more vulnerable to ESD voltage damage. In the past, it was enough for designers to select a product that would fit into the IEC61000-4-2 specification. As a result, most data sheets for protection products only meet the rating requirements. As the integrated circuit becomes more and more sensitive, newer designs have protection components to meet the standard rating, but the ESD shock will still cause excessive voltage, which could damage the IC. Therefore, the designer must select one or more protection products, not only to meet the ESD pulse requirements, but also to clamp the ESD shock to a sufficiently low voltage to ensure that the IC is protected. Figure 1: requirements for ESD protection of the A