lcd用cof挠性印制板制作工艺研究及pcb失效分析_61_65（Research on fabrication technology and PCB failure analysis of COF flexible printed circuit board for LCD _61_65）.docVIP

lcd用cof挠性印制板制作工艺研究及pcb失效分析_61_65（Research on fabrication technology and PCB failure analysis of COF flexible printed circuit board for LCD _61_65） This article is contributed by qly000888 Pdf documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view. Table 4-19 cross section 1 cross section 2 The coefficient of etching, line top width, circuit bottom width, line thickness, etching coefficient 21.97 mu m, 21.21 mu m, 28.41 mu m, 28.79 mu m, 11.74 mu m, 10.61 m 3.65, 2.80 for making COF flexible printed circuit board The roll production process parameters optimization method to transfer each process in the selection of fine line image under the condition of small batch trial product line reached 28 m, compared with the chip method to better meet the requirements for 30 m line width system. At the same time because the roll method has a high degree of automation, reduce artificial operation and management, by the influence of temperature and humidity change in cleanliness of the characteristics of small and short circuit and open circuit low incidence reached 92.1% in the rate of qualified products have better performance, and the products have passed the reliability test: thermal stress experiment of foaming and the solder layer; high and low temperature test line without fault; after salt fog test metal surface corrosion. Comparison of 4.5.3 chip method and coil type method From the above experimental results and discussion, can be seen in the strict control of fine line image transfer exposure, development and etching process parameters, selection of Nippon Steel CIPW-25080 type single without glue FCCL two mode of production can be produced with the 30 m linewidth of COF flexible printed board products, but because of the difference of two a process in the substrate transfer mode, there are still differences between the results of production. Chip production because the substra