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L 电子行业工艺术语surface mounted components/surface mounted devices (SMC/SMD) 表面组装元器件surface mount technology (SMT) 表面组装技术surface mounted assembly (SMA) 表面组装组件reflow soldering 再流焊 hot air reflow soldering 热风再流焊IR reflow soldering; infrared reflow soldering 红外再流焊Reflow atmosphere 再流气氛 laser reflow soldering 激光再流焊wave soldering 波峰焊 dual wave soldering 双波峰焊beam reflow soldering 光束再流焊 vapor phase soldering (VPS)气相再流焊assembly density 组装密度terminations 焊端lead foot; lead 引脚fine pitch devices (FPD) 细间距器件solder powder 焊料粉末thixotropy 触变性:流遍体（流变体焊膏）的粘度随着时间、温度、切变力等因素而发生变化的特性。slump踏落no-clean sol