手动焊装配建议锡铅焊接工艺-3Dplus.PDF

DISTRIBUTION LIST In charge of the document: Fabrice Soufflet – Process Engineering Group Copy to: Responsibility Pierre Maurice President Marie-Cécile Vassal Project Group Manager Dominique Blain Quality Assurance Manager Pierre Wang High Rel. Product Manager Doc. N°: 3300-1300-7 Page 2/25 This document is 3D PLUS property, it cannot be used by or communicated to third parties without written authorization CHANGE RECORD 变更记录 Ed./Rev. Date Verified and Description Writer approved by 7 05/19/2016 FS/PW/PEB/LLR  §1 : this recommendations document now WY addresses to SOP, QFP, PGA and PoL modules 此推荐文档是基于SOP QFP PGA 和PoL 封装的 模块.  §2 : three documents in reference added 增加了3 参考文档 RD4 :3641-0790 Side staking of a SOP module SOP 模块的侧面加固 RD5 :3641-0841 Underfilling of a SOP module SOP 模块 的底部填充 RD6 : 3300-1303-1 Validation of the mounting of 3D PLUS memory stacks on pcb 3D PLUS 模块的安装验证  §3 : flowchart added 增加了流程图  §6 : added note – module’s tinning bef