ICT夹具故障处理.doc

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ICT夹具故障处理

Troubleshooting, repairing, and maintaining fixtures 夹具的故障解决,修理和维护 This chapter contain information about troubleshooting fixtures for the most common problems encountered. Repair procedures follow troubleshooting tactics. This chapter also describes the recommended maintenance procedures to keep your fixtures operating properly over their full lifetime. 此章包括了在夹具上遇到的大多数普通的问题的解决。在故障发现之后就是修理过程。本章也描述了推荐的维护程序,以保持夹具在整个使用过程中工作顺利。 14.1 TROUBLESHOOTIING AND REPAIRING YOUR FIXTURES 发现夹具问题并修理夹具 The information presented here will help you solve most fixture problems whether they occur when the fixture first built or after the fixture has been in use for some time. First the problem is listed in the section heading, followed by possible causes and ways to fix the problem. 在这里介绍的情况将帮助你解决大多数的夹具问题,不论是在第一次做夹具的时候还是夹具已经使用了一段时间。 首先问题在每段开头列出了问题, 接着是可能的原因,以及解决问题的方法。 14.1.1 The Board Does Not Sit Flat On The Gasket 主板在垫圈上不能平放 1.This can be caused by components or component leads on the bottom side of the circuit board contacting spacers, gasket material, or the support plate itself. To fix this, you can move the spacers or gasket material, trim the leads, or cut a relief slot into the support plate. 这可能是由于在电路板底边的元件或元件引脚接触到了隔板,衬垫材料,或者是支撑板本身。为了解决它,你可以移动隔板或衬垫材料,修整引脚,或在支撑板上切割一个减压槽。 2. This can also be caused by uneven placement of probe; that is , more probes on one side of the board than the other. This can be especially true when connectors or high density components are probed. You can fix the problem by putting low force probes in these high probe density areas. Fixturing software takes probe density into consideration on the HP SimPlate Express fixture and recommends the use of low force probes in high density areas. However , the software doesn’t know probe locations on an HP SimPlate fixture; therefore, you will have to determine when and where to use low force probes. If the problem persists, you can

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