毕业论文中英文文献翻译 热能与动力工程专业毕业论文.docxVIP

英文原文Thermohydrodynamic characteristics of two-phase flow in aheated capillaryY.P. Peles, L.P. Yarin, G. Hetsroni*Department of Mechanical Engineering, Technion D Israel Institute of Technology, Haifa, IsraelReceived 14 May 1998; received in revised form 3 July 1999AbstractTwo-phase laminar flow in a heated capillary slot, driven by liquid evaporation from the interface, isinvestigated and a quasi-one-dimensional model is proposed. The model takes into account themultistage character of the process as well as the a.ect of capillarity, frictional and gravity forces on theflow development. The theoretical description of the phenomenon is based on the assumption ofuniform distribution of hydrodynamic and thermal parameters over the cross-section of the liquid andvapor flows. With this approximation, the mass, thermal and momentum equations for the averageparameters are obtained. These equations are solved to determine the velocity, pressure and temperaturedistributions along the capillary axis, the shape of the interfacial surface for various geometrical andregime parameters as well as various physical properties of the liquid and vapor. The e.ect of themicrochannel size, initial temperature of the cooling liquid, wall heat flux and gravity on the flow areconsidered. 7 2000 Elsevier Science Ltd. All rights reserved.1. IntroductionThe challenge posed by high electronic chip heat flux makes thermal management a keyfactor in the development of electronic systems. The cooling of microelectronic components bynew cooling technologies, as well as improving the existing ones, is becoming a necessity as power dissipation levels of integrated circuits increase and their sizes decrease. Miniature heat sinks, in which liquid flows, in silicon wafer, could signi?cantly improve the performance and reliability of semiconductor devices by increasing the e.ective thermal conductivity, decreasing the temperature gradients across the wafer, decreasing the maximum wafer temperature and red