应用黏弹性分析于预测射出产品之流动残留应力与光学性质研究.pdfVIP

模拟分析技术 应用黏弹性分析于预测射出产品之流动残留应力与光学性质 张元榕1邱显森1游朝凯1杨文贤1许嘉翔1张荣语2 (1科盛科技股份有限公司2国立清华大学化学工程学系) 摘要：近来充填流动所导致的残留应力，在塑料射出成型的制程中已经成为相当重要的课题．流动残留应力主要是塑料 高分子链在充填流动过程中在高剪切下受到拉伸作用所导致，而在充填之后的冷却与离模阶段将会持续被释放或冻结． 充填流动所发生的高分子排向与其所伴随的流动残留应力将影响成品的许多物理性质，如非等向性之机械．性质与光学性 质．本篇论文将整合黏弹性模型与三维数值模拟技术来预测射出成型制程中所发生的流动残留应力现象，并将残留应力 之结果进一步应用于预测射出成品的双折射分布． 关奠词：流动残余应力、黏弹性、射出成型 Viscoelasticto flOW—inducedresidualstressand analysispredict optical in ection propertiesinj molding Abastract．Inrecent stresscausedmelt behaviorhasbeen asoneoftheessentialissuesin years，residual by filling regarded due chainstretchedthe residualstressis to molecular injection generatedpolymer by hi曲 plastics molding．Flow-induced berelaxedorfrozen the evenafter shearrateof flow can plasticduringfilling，and duringpost-fillingprocess，and ejection． Molecularorientationresultedfrommelt andthe flow-inducedresidualstressesaffect filling corresponding manyphysical of as mechanic and this incorporate propertiesproducts，suchanisotropic propertiesopticalproperties．Inpaper,we in three—dimensionalnumerical to thisresidualstressinducedan viscoelasticmodelsan during integrated approachpredict stressresultis to the withinthe molded injection injectionmoldingprocess．Furthermore，theappliedpredictbirefringence part． word：f