TLP扩散连接的动力学模型研究.pdfVIP

TLP 扩散连接的动力学模型 1，2 2 陈思杰 ，井晓天 （1 河南理工大学材料科学与工程学院，焦作454000 ；2 西安理工大学材料科学与工程学院， 西安710048 ） 摘要：本文分析了瞬时液相扩散连接的动力学模型。瞬时液相扩散连接可以获得与母材相似 甚至相同的组织的接头，传统的 TLP 扩散连接方法可以有效地解决熔焊或扩散焊不能连接 的先进材料和金属基复合材料的连接问题。介绍了两种新的TLP 扩散连接模型，可以有效 提高接头的连接性能，一种是具有温度梯度的 TLP 扩散连接模型，该模型连接时不像传统 工艺模型那样进行等温凝固，而是在接头区域加上了一个温度梯度；另外一种是瞬时液相扩 散连接双温模型，其在等温凝固以前有一个短时加热过程。 关键词：扩散焊，动力学模型，瞬时液相扩散连接 Kinetics modeling of transient liquid phase bonding CHEN Si-jie1,2，JING Xiao-tian2 (1.School of Materials Science Engineering, Henan Polytechnic University, Jiaozuo Henan, 454000, china; 2.School of Materials Science Engineering , Xi’an University of Technology, Xi’an Shanxi,710048, china) Abstract: A review of the kinetics modeling of the transient liquid phase (TLP) bonding is presented in this paper. The transient liquid phase bonding process is unique in the sense of producing similar or even the same microstructure with the bonding interface. Conventional TLP diffusion bonding has been of interest when joining advanced alloys and metal-matrix composites for which neither fusion welding nor solid-state bonding methods might be successful. Two novel method of bonding process has been developed which is capable of reliably providing excellent bonds. One is the temperature gradient- transient liquid phase (TG-TLP) diffusion bonding. This new method relies on imposing a temperature gradient across the bond line when TLP diffusion bonding rather than maintaining a uniform temperature during bonding. Other is the two-step heating transient liquid phase (TS-TLP) diffusion bonding method which is based on imposing a short-time high heating temperature before the isothermal solidification of the liquid layer. Keywords: Diffusion bonding , kinetics modeling , TLP bonding 引言 随着航空航天、微电