ad7705布线规则.docVIP

ad7705布线规则 AD7705的布线规则翻译，有几点不懂，请指点 1.Avoid running DIGITAL LINEs under the DEVICE, because they couple noise onto the die. 避免数字线布在芯片下，因为会将噪声耦合到die? 2.The ANALOG ground plane should be allowed to run under the AD7705/AD7706 to avoid noise coupling. 模拟地可以布在芯片下，以避免噪声耦合。 3.The POWER supply LINEs to the AD7705/AD7706 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the POWER supply LINE. 尽量加宽电源线，可以提供低阻抗，和降低电源线上的短时脉冲。 4. FAST switching signals, such as clock signals, should be shielded with DIGITAL ground to avoid radiating noise to other sections of the board, and clock signals should never be run near the ANALOG inputs. 快速切换的信号，例如时钟信号，应该包地，以避免将噪声辐射到其他部分。 shielded with DIGITAL ground 是包地吗？ 4.Avoid crossover of DIGITAL and ANALOG signals. 避免数字和模拟信号交叉。数字和模拟信号如何交叉？数字信号在电路板正面，模拟信号在电路板反面，这是交叉的意思吗？如果不是，能给个图演示一下吗 5.Traces on opposite sides of the board should run at right angles to each other. 完全不懂是什么意思？？ 6. This reduces the effects of feedthrough through the board. 这会降低feedthrough影响??? 7. Using a microstrip technique works best, but it is not always possible to use this method with a double-sided board. In this technique, the component side of the board is dedicated to ground planes, and signals are placed on the solder side. 使用微带技术最好不过了，（什么是microstrip technique？？？）但在双层电路板，使用这种方法不是总有可能。使用这种技术，有元器件的一边铺地，信号布在反面。 2楼： 参与讨论 作者： adamzhao 于 2006-2-9 14:38:00 发布： -------------------------------------------------------------------------------- 部分答案 1.Avoid running DIGITAL lines under the DEVICE, because they couple noise onto the die. 避免在芯片（AD7705）下面走数字线，因为它们会把噪声耦合到裸片上。 die：就是ic未封装前的晶粒,是从硅晶片(wafer)上用激光切割下,把die焊在框架上,再在die上面焊接上金线后形成ic裸芯片,再拿去塑封. 4. FAST switching signals, such as clock signals, should be shielded with DIGITAL ground to avoid radiating noise to other sections of the board, and clock signals should never be run near the ANALOG inputs. 快速切换的信号，例如时钟信号，应该用地线屏蔽，以避免将噪声辐射到其他部分。 5.Traces on opposite sides of the