於胺基磺酸浴中电镀镍与电镀钴镀层之高温退火行为-YOKE.PDFVIP

於胺基磺酸浴中電鍍鎳與電鍍鈷鍍層之高溫退火行為 Annealing Behavior of Nickel Electrodeposition and Cobalt Electrodeposition from Sulfamate Bath 1,2 2* 1 陳黼澤 、林招松 、潘永寧 1 2 臺灣大學機械工程學系暨研究所 臺灣大學材料科學與工程學系暨研究所 Fu-Je Chen1, 2, Chao-Sung Lin2* and Yung-Ning Pan1 1Department of Mechanical Engineering, National Taiwan University 2Department of Materials Science and Engineering, National Taiwan University 摘 要 本研究主要探討胺基磺酸浴所電鍍的鎳金屬與鈷金屬鍍層經高溫退火熱處理後的微結構演變和高溫強度， 實驗結果顯示純鎳鍍層會隨著熱處理溫度升高即開始歷經回復、再結晶與晶粒成長行為，導致鎳鍍層硬度會逐 漸呈現軟化現象。然而，鈷鍍層硬度會隨著熱處理溫度升高而有微幅硬化的趨勢，顯示鈷金屬鍍層的高溫穩定 性優於鎳鍍層。但是過高的熱處理溫度也將使鈷鍍層微結構發生再結晶行為與晶粒成長而導致硬度急遽下降。 值得注意的是，鈷鍍層熱處理溫度高於相變態溫度時，HCP 鈷晶粒結構會轉變成高溫穩定相的沃斯田體FCC 結 構，當空冷至室溫時，鈷鍍層會有麻田散體HCP 結構和殘留的高溫穩定相沃斯田體FCC 共存的結構，同時HCP 鈷晶粒會含有高密度疊差的晶格缺陷而有細化材料結晶區塊的效益，而鎳鍍層在高溫退火後，鎳晶粒內部結晶 缺陷密度較低，故鈷鍍層高溫機械強度優於鎳鍍層。 關鍵字：鎳鍍層、鈷鍍層、微結構、高溫穩定性。 Abstract In this study, the microstructure transformation and high temperature strength of nickel and cobalt electrodeposits from sulfamate baths were investigated. Results showed that pure nickel deposit experienced recrystallization and grain growth at increased heat treatment temperatures that caused a reduction in the deposit hardness. On the other hand, pure cobalt deposit exhibited thermal hardening at specific temperature ranges that is a more thermally stable deposit than pure nickel deposits. However, pure cobalt deposits also experienced recrystallization and grain growth at higher temperatures. It is worth noting that HCP cobalt grain structure transformed into a high temperature stable FCC austenite at temperatures above the allotropic temperatures of cobalt. As cobalt deposit