Low Loss LTCC Cavity Filters Using System on Package Technology at 60 GHz英文文献.pdfVIP

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 53, NO. 12, DECEMBER 2005 3817 Low-Loss LTCC Cavity Filters Using System-on-Package Technology at 60 GHz Jong-Hoon Lee, Student Member, IEEE, Stephane Pinel, Member, IEEE, John Papapolymerou, Senior Member, IEEE, Joy Laskar, Fellow, IEEE, and Manos M. Tentzeris, Senior Member, IEEE Abstract— In this paper, three-dimensional (3-D) integrated high quality ( ) factor compared to stripline/microstrip [3], [4] cavity resonators and filters consisting of via walls are demon- or lumped-element-type filters [5]. strated as a system-on-package compact solution for RF front-end Numerous publications [6]–[15] have dealt with 3-D low-loss modules at 60 GHz using low-temperature cofired ceramic (LTCC) technology. Slot excitation with a 4 open stub has and high- resonators/bandpass filters (BPFs) utilizing electro- been applied and evaluated in terms of experimental performance magnetic bandgap (EBG) substrates and micromachined tech- and fabrication accuracy and simplicity. The strongly coupled nology. In particular, the recent development of Duroid-based cavity resonator provides an insertion loss 0.84 dB, a return EBG cavity resonators and filters [6], [7] have demonstrated loss 20.6 dB over the passband ( 0.89 GHz), and a 3-dB band- advantages of implementing EBG instead of fully conducting width of approximately 1.5% ( 0.89 GHz), as well as a simple fabrication of the feeding structure (since it does not require to metals [8] as sidewalls in terms of reconfigurability and inex- drill vias to implement the feeding structure). The design has pensive mass production. The idea of