Deep etching of glass wafers using sputtered molybdenum masks英文文献.pdfVIP

IOP PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING J. Micromech. Microeng. 19 (2009) 067001 (6pp) doi:10.1088/0960-1317/19/6/067001 TECHNICAL NOTE Deep etching of glass wafers using sputtered molybdenum masks Frederik Ceyssens and Robert Puers KULeuven, Dept. ESAT-MICAS, Kasteelpark Arenberg 10, Leuven, Belgium E-mail: fceyssen@esat.kuleuven.be Received 11 March 2009, in final form 17 April 2009 Published 20 May 2009 Online at stacks.iop.org/JMM/19/067001 Abstract This note presents a simple, low-cost technology to fabricate very deep isotropically etched features in glass wafers. A process based on fast etching glass combined with a stress-optimized molybdenum mask layer and a photoresist was found to be very suitable for such purposes. The obtained performance, up to 1.2 mm deep etching, rivals the best existing techniques while being more cost-competitive and using widely available equipment. (Some figures in this article are in colour only in the electronic version) 1. Introduction The purpose of this work is to obtain a performance similar to the best reported in terms of maximum etch depth and mask Of all substrates, glass certainly offers the most attractive undercut, using only low-cost materials and processes. The resource for the fabrication of optical and fluidic investigation focused on achieving this by the use of a low-cost microsystems. The cost of quality glass substrates is at float glass and a masking technique based on a simple sputtered least one order of magnitude lower than for silicon, an metal mask. Emphasis is put on processing optimization to obvious advantage,